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 HD74HC423A
Dual Retriggerable Monostable Multivibrators
REJ03D0626-0200 (Previous ADE-205-505) Rev.2.00 Mar 30, 2006
Description
This multivibrator features output-pulse-duration control by two methods. The basic pulse duration is programmed by selection of external resistance and capacitance values. Once triggered, the basic pulse duration may be extended by retriggering the gated low-level-active (A) or high-level-active (B) inputs, or be reduced by use of the overriding clear. The B input is a Schmitt trigger enabling jitter-free triggering from input signals with slow transition rates.
Features
* High Speed Operation * High Output Current: Fanout of 10 LSTTL Loads * Wide Operating Voltage: VCC = 2 to 6 V * Low Input Current: 1 A max * Low Quiescent Supply Current * Ordering Information
Part Name HD74HC423AP HD74HC423AFPEL Package Type DILP-16 pin SOP-16 pin (JEITA) Package Code (Previous Code) PRDP0016AE-B (DP-16FV) P Package Abbreviation -- EL (2,000 pcs/reel) Taping Abbreviation (Quantity)
PRSP0016DH-B FP (FP-16DAV) Note: Please consult the sales office for the above package availability.
Function Table
Clear L X X H Note: Inputs A X H X L Outputs B X X L H Q L L L Q H H H
H 1. H; High level, L; Low level, X; Irrelevant
Rev.2.00 Mar 30, 2006 page 1 of 8
HD74HC423A
Pin Arrangement
1A 1B 1CLR 1Q 2Q 2Cext 2Rext/Cect GND 1 2 3 4 5 6 7 8 CLR CLR 16 15 14 13 12 11 10 9 VCC 1Rext/Cext 1Cext 1Q 2Q 2CLR 2B 2A
(Top view)
Logic Diagram (1/2)
Rext Cext VCC VH VL
OUT
Q Q
A B CLR
CK CK CLR
To Another Transceiver
Absolute Maximum Ratings
Item Supply voltage range Input / Output voltage Input / Output diode current Output current VCC, GND current Power dissipation Symbol VCC VIN, VOUT IIK, IOK IOUT ICC or IGND PT Ratings -0.5 to 7.0 -0.5 to VCC +0.5 20 25 50 500 Unit V V mA mA mA mW
Storage temperature Tstg -65 to +150 C Note: The absolute maximum ratings are values, which must not individually be exceeded, and furthermore, no two of which may be realized at the same time.
Rev.2.00 Mar 30, 2006 page 2 of 8
HD74HC423A
Recommended Operating Conditions
Item Supply voltage Input / Output voltage Operating temperature Input rise / fall time Note:
*1
Symbol VCC VIN, VOUT Ta tr , tf
Ratings 2 to 6 0 to VCC -40 to 85 0 to 1000 0 to 500 0 to 400
Unit V V C
Conditions
VCC = 2.0 V ns VCC = 4.5 V VCC = 6.0 V
1. This item guarantees maximum limit when one input switches. Waveform: Refer to test circuit of switching characteristics.
Electrical Characteristics
Ta = 25C Item Input voltage Symbol VCC (V) VIH 2.0 4.5 6.0 VIL 2.0 4.5 6.0 2.0 4.5 6.0 4.5 6.0 VOL 2.0 4.5 6.0 4.5 6.0 Input current Quiescent Standby Supply state current Active state Iin ICC 6.0 6.0 Min 1.5 3.15 4.2 -- -- -- 1.9 4.4 5.9 4.18 5.68 -- -- -- -- -- -- -- -- Typ -- -- -- -- -- -- 2.0 4.5 6.0 -- -- 0.0 0.0 0.0 -- -- -- -- -- Max -- -- -- 0.5 1.35 1.8 -- -- -- -- -- 0.1 0.1 0.1 0.26 0.26 0.1 130 130 Ta = -40 to+85C Min 1.5 3.15 4.2 -- -- -- 1.9 4.4 5.9 4.13 5.63 -- -- -- -- -- -- -- -- Max -- -- -- 0.5 1.35 1.8 -- -- -- -- -- 0.1 0.1 0.1 0.33 0.33 1.0 220 220 A A IOH = 4 mA IOH = 5.2 mA Vin = VCC or GND Vin = VCC or IOUT = 0 A GND Rext / Cext = 0.5 VCC V IOH = -4 mA IOH = -5.2 mA Vin = VIH or VIL IOL = 20 A V Unit V Test Conditions
Output voltage
VOH
V
Vin = VIH or VIL IOH = -20 A
Rev.2.00 Mar 30, 2006 page 3 of 8
HD74HC423A
Switching Characteristics (CL = 50 pF, Input tr = tf = 6 ns)
Ta = 25C Item Propagation delay time Symbol VCC (V) tPLH 2.0 4.5 6.0 tPHL 2.0 4.5 6.0 2.0 4.5 6.0 tPLH 2.0 4.5 6.0 2.0 4.5 6.0 Removal time trem 2.0 4.5 6.0 2.0 4.5 6.0 tWQ tTLH tTHL Cin 4.5 2.0 4.5 6.0 -- -- Min -- -- -- -- -- -- -- -- -- -- -- -- 150 30 26 0 0 0 -- -- -- -- -- -- -- -- -- Typ -- 20 -- -- 21 -- -- 17 -- -- 15 -- -- 6 -- -- -3 -- 1.5 450 380 1.0 -- 5 -- -- 5 Max 210 42 36 240 48 41 170 34 29 180 36 31 -- -- -- -- -- -- -- -- -- -- 75 15 13 20 10 Ta = -40 to +85C Min -- -- -- -- -- -- -- -- -- -- -- -- 190 38 33 5 5 5 -- -- -- -- -- -- -- -- -- Max 265 53 45 300 60 51 215 43 37 225 45 38 -- -- -- -- -- -- -- -- -- -- 95 19 16 20 10 pF Pins 7 & 15 Other pins ns Clear ns Clear to Q ns A or B to Q Unit ns Test Conditions A or B to Q
tPHL
ns
Clear to Q
Pulse width
tw
ns
A, B, Clear
Minimum output pulse width Output pulse width Output rise/fall time Input capacitance
tWQ (min)
s ns ms ns
Cext = 28 pF
Rext = 6 k Rext = 2 k
Cext = 0.1 F, Rext = 10 k
Caution in use: In order to prevent any malfunctions due to noise, connect a highfrequency performance capacitor between VCC and GND, and keep the wiring between the external components and Cext, Rext/Cext pins as short as possible.
Test Circuit
Measurement point
CL*
Note: CL includes the probe and fig capacitance.
Rev.2.00 Mar 30, 2006 page 4 of 8
HD74HC423A
Application Data
Vcc = 2.5 V
10000.0
Output Pulse Width twQ (s)
1000.0
100.0
10.0
Rext
1.0 1 k 10 k 100 k 1 M
0.1 102 103 104 105 106 107
Timing Capacitance Cext (pF)
Vcc = 3.3 V
10000.0
twQ (s) Output Pulse Width
1000.0
100.0
10.0
Rext
1.0 1 k 10 k 100 k 1 M
0.1 10
2
10
3
10
4
10
5
10
6
10
7
Timing Capacitance Cext (pF)
Rev.2.00 Mar 30, 2006 page 5 of 8
HD74HC423A
Vcc = 5.0 V
10000.0
Output Pulse Width twQ (s)
1000.0
100.0
10.0
Rext
1.0 1 k 10 k 100 k 1 M
0.1 102 103 104 105 106 107
Timing Capacitance Cext (pF)
Rev.2.00 Mar 30, 2006 page 6 of 8
HD74HC423A
Rext = 2 k Cext 1.7
1000 pF 10000 pF 100000 pF 1000000 pF
1.8
Coefficient of Output Pulse Width K
1.6
1.5
1.4
1.3
1.2 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
Supply Voltage Vcc (V)
1.6
Rext = 10 k Cext
Coefficient of Output Pulse Width K
1.5
1000 pF 10000 pF 100000 pF 1000000 pF
1.4
1.3
1.2
1.1
1.0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
Supply Voltage Vcc (V)
Rev.2.00 Mar 30, 2006 page 7 of 8
HD74HC423A
Package Dimensions
JEITA Package Code P-DIP16-6.3x19.2-2.54 RENESAS Code PRDP0016AE-B Previous Code DP-16FV MASS[Typ.] 1.05g
D
16
9
1 0.89 b3
8
Z
A1
A
E
Reference Symbol
Dimension in Millimeters
Min
e
bp
e1
c
( Ni/Pd/Au plating )
e1 D E A A1 bp b3 c e Z L
Nom Max 7.62 19.2 20.32 6.3 7.4 5.06
L
0.51 0.40 0.48 0.56 1.30 0.19 0.25 0.31 0 15 2.29 2.54 2.79 1.12 2.54
JEITA Package Code P-SOP16-5.5x10.06-1.27
RENESAS Code PRSP0016DH-B
Previous Code FP-16DAV
MASS[Typ.] 0.24g
*1
D F 9
16
NOTE) 1. DIMENSIONS"*1 (Nom)"AND"*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET.
bp
HE
E
Index mark
*2
Terminal cross section ( Ni/Pd/Au plating )
1 Z e
*3
8 bp x M L1
Reference Symbol
c
Dimension in Millimeters
A1
y
L
Detail F
D E A2 A1 A bp b1 c c1 HE e x y Z L L1
Min Nom Max 10.06 10.5 5.50 0.00 0.10 0.20 2.20 0.34 0.40 0.46 0.15 0.20 0.25 0 8 7.50 7.80 8.00 1.27 0.12 0.15 0.80 0.50 0.70 0.90 1.15
Rev.2.00 Mar 30, 2006 page 8 of 8
A
Sales Strategic Planning Div.
Keep safety first in your circuit designs!
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.
RENESAS SALES OFFICES
Refer to "http://www.renesas.com/en/network" for the latest and detailed information. Renesas Technology America, Inc. 450 Holger Way, San Jose, CA 95134-1368, U.S.A Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501 Renesas Technology Europe Limited Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K. Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900 Renesas Technology (Shanghai) Co., Ltd. Unit 204, 205, AZIACenter, No.1233 Lujiazui Ring Rd, Pudong District, Shanghai, China 200120 Tel: <86> (21) 5877-1818, Fax: <86> (21) 6887-7898 Renesas Technology Hong Kong Ltd. 7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2730-6071 Renesas Technology Taiwan Co., Ltd. 10th Floor, No.99, Fushing North Road, Taipei, Taiwan Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999 Renesas Technology Singapore Pte. Ltd. 1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632 Tel: <65> 6213-0200, Fax: <65> 6278-8001 Renesas Technology Korea Co., Ltd. Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea Tel: <82> (2) 796-3115, Fax: <82> (2) 796-2145
http://www.renesas.com
Renesas Technology Malaysia Sdn. Bhd Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No.18, Jalan Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia Tel: <603> 7955-9390, Fax: <603> 7955-9510
(c) 2006. Renesas Technology Corp., All rights reserved. Printed in Japan.
Colophon .6.0


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